TL;DR: Intel and SoftBank unveiled next-generation ZAM memory prototypes featuring a unique Z-angle interconnect architecture that improves thermal management and reduces power consumption by 40-50%.

ZAM, a stacked DRAM alternative to HBM with a claimed 40-50% power advantage and 2x-3x density advantage over HBM, is the product of a jv between Softbank, Tokyo University and Intel called Saimemory ...

Intel has unveiled the first prototype of the Z-Angle Memory (ZAM) it's co-developing with Softbank subsidiary Saimemory. As WCCFTech reports, the company didn't have any working samples at Intel ...

TL;DR: Intel partners with SoftBank's SAIMEMORY to advance next-generation DRAM bonding technology using Z-Angle Memory (ZAM), enabling higher capacity, lower power consumption, and improved ...

SAIMEMORY—founded in December 2024, and officially launched in June 2025—is a joint venture between SoftBank, Intel, and the University of Tokyo.